PAA now representing A.C.E. Production Technologies
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October, 2008:
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A.C.E. offers a complete line of selective soldering solutions from semi-automatic bench top systems to fully programmable in-line solutions.
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PAA now representing Smart Sonic
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February, 2008:
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Smart Sonic offers a complete line of ultrasonic stencil cleaners from desk top to fully automatic. Smart Sonic offers a full turn key solution including evaporator and 440-R SMT Detergent.
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PAA exhibiting at Nepcon East 2007 (October 30 & 31) – Booth 815
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September, 2007:
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PAA will be hosting a collaborative booth at the new Boston Convention and Exhibition Center. The following suppliers will be exhibiting their products: Siemens, Phoenix x-ray, Mirtec, Alpha Metals, BTU, Grid-Lok, Pressure Products and, RMD Instruments.)
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PAA now representing Alpha Metals division of Cookson Electronics
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August, 2007:
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PAA now representing Alpha’s suite of assembly materials and services. Products include solder paste, bar solder, wire solder, preforms, fluxes SMD adhesives, cleaning chemistries and stencils. Services range from solder pot analysis to lead free process validation.
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PAA Celebrates 10 Year Milestone!
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March 2006:
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PAA celebrates 10th anniversary of providing New England with quality products and services. Thank you to all our customers that have made it possible.
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Mirtec Introduces Multi-Camera Benchtop AOI System
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February 2006:
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Mirtec USA introduces MV-3HT to North American market @ APEX 2006. The MV-3HT is configured with one top side camera and four side angled cameras for added viewing angles when desired.
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Siemens Announces Virtual Product Build Software Seminar in Conjunction with Nepcon East
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March, 2004:
Siemens Dematic has announced a Virtual Product Build Software Seminar on May 5th in conjuction with Nepcon East. Siemens SiPlace Pro software introduces a revolutionary new software feature for Virtual Product Build product builds with 100% virtual placement & setup inspection. This feature significantly improves efficiency by keeping the assembler free to run only production jobs instead of red light time required for time consuming first article inspection to be completed. Siplace Pro improves SMT factory performance at many levels due to an easy to learn user interface and simple to maintain central database.
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PAA Announces Participation in Nepcon East 2004 - Booth #2736
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March, 2004:
NEPCON EAST - PAA Booth # 2736 Hynes Convention Center – Boston May 5 & 6
PAA will be hosting a collaborative booth at Nepcon East 2004 with the following suppliers exhibiting their equipment. Siemens Dematic HF3 Assembler, PMJ Datum™ automatic router, Grid-Lok™ by Ovation Products automatic compliant support tooling, PresSure Products N29 ultrasonic stencil cleaner, Mirtec MV-2HTL desktop AOI system, PMT X1 Precision rework station and M.E.T. stencils.
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Grid-Lok™ by Ovation Products Announced as Winner of Prestigious SMT Vision Award for Tooling
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February, 2004:
Grid-Lok™ by Ovation Products was awarded the prestigious 2004 VISION AWARD in the category of PCB Tooling by SMT Magazine for their Grid-Lok™ automatic compliant tooling solution. Grid-Lok™ drastically reduces or eliminates setup time for bottom side board support in double sided printing and placement applications. Grid-lok’s "Stealth Mode" enables the system to be fully integrated with the host Printer, Pick & Place and Dispenser of most major SMT manufacturers, thereby making it capable of setting and resetting to each and every consecutive PCB that passes through the machine.
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Ekra Introduces Low Cost, High Performance X4 Fully Automatic In-line Screen Printer at Under $70K
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February, 2004:
EKRA introduced at APEX the fully automatic in-line X4 stencil printer and fully automatic in-line X5 II stencil printer.
The X4 offers many of the advantages of existing EKRA printers, but at price under $70K. Features offered include 2 1/4D post print inspection, adjustable stencil rails and intelligent stencil wiper system and a print area up to a maximum of 18” by 18”.
The X5 II offers all of the advantages of the fully featured E5 printer series at a significantly lower price. Features offered include 2 1/2D post print inspection, adjustable stencil rails and intelligent stencil wiper system and a print are up to a maximum of 21” by 21”.
The X4 and X5 II screen printers offer unmatched accuracy performance of +/- .0005” @ 6 sigma. No other stencil printer manufacturer can offer this level of accuracy and price performance.
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BTU Introduces Lead Free Ready Pyramax 150 X5 Reflow Oven
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February, 2004:
BTU introduced at APEX the lead free ready Pyramax 150 X5 reflow oven. The Pyramax 150 X5 uses BTU's patented closed loop convection control for unmatched, precision control of critical thermal processing variables. Closed loop convection control provides continuous monitoring and feedback of heating and cooling convection rates, with adjustments automatically made by the system's operating software. This ultimate repeatable process control ensures staying within the tight process window critical for lead-free processing.
The release of the Pyramax 150 X5 compliments the existing Pyramax product line which includes the Pyramax 150 Nitrogen reflow oven, Pyramax 98 Air reflow oven and the Pyramax 98 Nitrogen Reflow oven. The entire Pyramax product line is lead free ready.
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Siemens Dematic Introduces SIPLACE HF/3
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November, 2003:
The SIPLACE HF/3 sets a new standard as the industry’s first multifunctional “Parallel Gantry”™ placement system by combining two distinct placement areas in a single machine. Configuring the first placement area with Siemens’ proven high speed Collect & Place Heads followed by a highly flexible Twin Head enables an unmatched combination of high speed (42,000 cph), high accuracy (30 µm at 4 sigma) and extensive component range (01005 through 200 x 125mm).
Meeting the needs for both high speed/flexible application in addition to prototyping and NPI, the HF/3 can be equipped with up to 180 spliceable tape feeders that can be quickly loaded on the machine with precision docking feeder trolleys. The HF/3 is engineered with an advanced positioning system to meet the market demands for higher accuracy with greater reliability. All axis of motion is driven by linear motors and supported by an industry first carbon fiber gantry frame that is five times lighter and twice as rigid as steel.
The SIPLACE Twin-Head on the HF/3 is equipped with a stationary camera system featuring a 50 x 40 mm field of view. Components can be illuminated from four different angles: 0º for recognizing strip connectors, CCGAs, etc.; and 30º, 60º, and 90º for leads or balls. In addition, four completely programmable lighting setups with fixed illumination angles allow fast, reliable recognition and measurement of every component at the correct angle.
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Precision Automation Signs On Zestron
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November, 2003:
PAA signed on as exclusive representative of Zestron’s cleaning solutions in New England.
For over a decade, Zestron has been providing the technology and know-how for high precision cleaning applications in the electronic manufacturing industry. ZESTRON® has emerged as the leading global supplier of cleaning agents and processes through its continuous commitment to meet the specific needs of every cleaning application.
ZESTRON® cleaning agents have been specifically designed to remove flux residues and SMT-adhesives, as well as solder pastes during and after the main PCB manufacturing processes.
For additional information or assistance, please contact ZESTRON® Corporation
at the toll free number (888) 999 9116 or infousa@zestron.com
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